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Home Life

xMEMS Labs showcases micro-actuators and active cooling chips for wearable devices
Make the wearing experience and sound listening experience of smart wearable devices great

Author: Mash Yang
2025-09-16
in Life, Hard body, Processor
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At the xMEMS Live Asia 2025 event held in Taipei, xMEMS Labs (Zhiwei Electronics) showcased its products for wearable devices,A micro drive unit called Sycamore-W, and launched the micro active cooling chip "µCooling" for wearable devices such as smart glasses, boasting a fanless design to gain more development opportunities in more market applications.

xMEMS Labs launches micro-active cooling chip "µCooling" for wearable devices such as smart glasses

xMEMS Labs states that the micro-driver unit, named Sycamore-W, designed for wearable devices, actually has the same technical principles behind it as its solid-state cooling chip, and is equally waterproof, dustproof, and even shock-resistant. However, compared to the solid-state cooling chip, which uses a low-frequency method to drive heat dissipation, Sycamore-W uses a high-frequency method, emitting bright sound through small holes on the side, and can also add a rich low-frequency sound experience.

Compared to traditional translucent diaphragm designs, Sycamore-W is only 1mm thick and weighs only 150mg. Compared to the current sound-generating units used in smartwatches, it is approximately 70% smaller (approximately 20 x 4 x 1.28mm). This allows product manufacturers to incorporate larger batteries or more sensor components into smartwatches.

xMEMS Labs says Sycamore-W takes up a smaller volume, even smaller than the sound module used in the Apple Watch (the component in the top photo).

As for the micro-active cooling chip "µCooling" for wearable devices such as smart glasses, the overall size is only approximately 9.3 x 7.6 x 1.13 mm. It can be directly integrated into the smart glasses frame and effectively reduce the surface temperature of the device by up to 40%, thereby allowing smart glasses to achieve 60-70% or higher performance efficiency, while also allowing users to wear it for long periods of time without discomfort due to high temperatures.

Unlike traditional fans, µCooling uses a solid-state vibration module to drive airflow, making it almost completely silent and vibration-free. This makes it ideal for wearable devices that are sensitive to sound and have extremely limited internal space.

▲ Launch of micro active cooling chip "µCooling" for wearable devices such as smart glasses

xMEMS Labs said that this technology can significantly improve the frequency reduction or discomfort problems of smart glasses caused by overheating, while enhancing reliability and practicality for all-weather wear.

Both designs are currently in talks with industry partners for adoption. Sycamore-W will begin mass production in the second quarter of 2026, while µCooling has already begun providing samples for testing and is expected to enter mass production in early 2026.

Separately, xMEMS Labs announced that its flagship Cypress full-band MEMS speaker and Alta-S driver ASIC are ready for mass production, signaling that its full-band solid-state audio solution will not only enter commercial use but also meet the stringent sound requirements of active noise-cancelling true wireless headphones.

xMEMS Labs also announced a strategic partnership with Rayking Electronics (Dongguan). The two parties will jointly develop Cypress and Alta-S one-stop speaker modules for application in the next generation of true wireless headphones.

▲xMEMS Labs' representative product, the Cypress full-band MEMS speaker and its Alta-S driver ASIC, are ready for mass production.

 

Tags: xMEMS LabsxMEMS Live Asia 2025Zhiwei Electronics
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Mash Yang

Mash Yang

Founder and editor of mashdigi.com, and student of technology journalism.

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