Piezoelectric MEMS technologyFor headphone sound unitxMEMS Labs (X-Microelectronics), which has subsequently used its technology to create an air-cooled all-silicon active heat sink, showcased its design products at a seminar held in Taiwan today (9/12). xMEMS Labs CEO Jiang Zhengyao further stated that its future product development will focus on heat sink products, and it will continue to develop headphone sound unit applications.
At the same time, Jiang Zhengyao stated that he is currently in talks with many semiconductor and packaging-related companies. He also expects that his products will be able to have more application possibilities in small devices such as mobile phones through features such as high customization and the provision of different air inlet directions.
Proposed in August this yearAir-cooled all-silicon active heatsink XMC-2400 µCooling designThe dimensions are only 9.26 x 7.6 x 1.08mm and the weight is only 150mg. Compared with traditional active heat dissipation cooling design, it can reduce the occupied volume by up to 96% and the weight can be reduced by up to 96%. Even the driving voltage is only 3V, and the potential difference can be used to indirectly supplement the power during the driving process, thereby achieving a power saving effect.
xMEMS Labs also touts its patented design as featuring a simple structure, enabling rapid changes in cooling modes based on customer needs, even allowing for customized designs. Furthermore, it can be adjusted to different sizes based on actual applications. Therefore, as mobile phones become increasingly thinner and lighter, and demands for processor performance continue to increase, its proposed cooling solutions are expected to become a key market need.
Jiang Zhengyao pointed out that while its product designs can be resized to meet specific needs, its current development focus is on small devices. However, xMEMS Labs will continue to monitor the potential applications of its products in various fields to seize greater growth opportunities.
As for the continued promotion of its heat sink solutions, and even listing heat sink solutions as the current main development axis, xMEMS Labs emphasized that it will continue to develop headphone solutions and continue to promote the design of sound units that can interpret more delicate sound details through its piezoelectric micro-electromechanical technology.
