Active cooling solution provider Ventiva collaborated with Intel at CES 2025, using its ICE9 cooling design for Intel's Core Ultra 200V series processors codenamed "Lunar Lake." The company also partnered with Dell to create a concept laptop, achieving efficient and silent cooling performance in a laptop less than 1.2 cm thick.
The ICE9 cooling design is based on Ventiva's patented ICE cooling technology. Through a non-mechanical fan operation design, it can generate air particle vibration, thereby achieving a vibration-free and completely silent cooling effect. It also avoids occupying internal space of the device, allowing laptops using this cooling solution to have greater design flexibility. Not only can it realize the design of laptops with a thickness of less than 1.2 cm, but it can also allow laptops to accommodate larger battery capacities.
ICE cooling technology is based on the principles of electrohydrodynamics (EHD). It dissipates heat primarily through the flow of ionized air molecules within an electric field. This eliminates the need for mechanical fans, simplifying cooling solution design and preventing the accumulation of dust that can occur with traditional fans over extended periods of operation. This allows for thinner and lighter designs.
However, this design solution is currently only applicable to devices with a 30W thermal design power consumption (TDP), primarily for thin and light notebooks. This collaboration with Intel is expected to further expand its application to thin and light notebook designs across a wider range of brands.
