Earlier at the 2022 World Semiconductor Conference held at the Nanjing International Expo Center, TSMC Vice President Fang Chen stated that its N3 (3nm) process technology will enter mass production in the second half of this year and is already collaborating with some customers in the mobile device and high-performance computing application fields.
Barring any unforeseen circumstances, TSMC should collaborate with Apple and Qualcomm on the first wave of 3nm process technology application products. Apple is expected to first use the 3nm process for the new Apple Silicon processor to be launched in the second half of the year, while Qualcomm may use it for the Snapdragon processor to be launched with the first wave of products as early as the end of this year, and will be widely used in more mobile devices next year.
在N3製程技術之後，台積電日前也透露將接續推出N3E、N3P、N3X三個製程技術，預計會在2025年以前陸續進入量產，預期將以N3製程技術改進、提升效率為主。
In addition to Apple and Qualcomm, companies including MediaTek, Intel, and AMD also plan to use TSMC's 3nm process technology to produce their processor products, but sufficient production capacity is not expected until 2023. Therefore, this year, only Apple and Qualcomm may successfully obtain TSMC's 3nm process foundry resources.
In addition to TSMC's entry into the 3nm process, Samsung has recently announced the first wave of 3nm process products.Already shippedHowever, the actual production capacity is not high. Therefore, Samsung emphasized that it will continue to increase production capacity to meet market demand. In addition, it plans to invest 5 trillion won to increase 4nm process capacity in order to win orders from customers such as Qualcomm, NVIDIA, and Supermicro.
