Last year, Intel, AMD, Microsoft, Meta, Google, Qualcomm, Samsung, TSMC and other companies announced a joint ventureUCIe Industry AllianceAfter proposing the UCIe 1.0 design specification to promote the application ecosystem based on chiplet technology, it announced the launch ofUCIe 1.1 version design specification.
The UCIe 1.1 design specification not only expands reliability mechanisms to support more protocols and a wider range of design usage models, but also incorporates enhanced computing capabilities for vehicle use, including predictive failure analysis and operational status monitoring, while also enabling packaging at a lower cost.
In conjunction with the inclusion of vehicle computing requirements in the UCIe 1.1 design specification, the UCIe Alliance will also establish a new automotive working group to incorporate more automotive-related computing application technologies and designs.
Furthermore, the UCIe 1.1 design is also backward compatible with the 1.0 version specification, meaning it is based on the same chip interconnection and compatible operation, allowing more companies to build new processors according to the standard and achieve differentiated designs with different microchip architectures. It can also utilize the mature PCI Express (PCIe) and CXL (Compute Express Link) connection protocols to achieve faster data transmission efficiency.
Dr. Debendra Das Sharma, Chairman of the UCIe Alliance, stated that as the industry focuses on UCIe technology development, the chiplet ecosystem will gradually build. With the release of the UCIe 1.1 specification, the chiplet ecosystem will be driven forward through larger collaborative projects.
