Today (September 9th), the Semiconductor Industry Association (SEMI) announced the official establishment of the 9DIC Advanced Manufacturing Alliance (2025DICAMA) at SEMICON Taiwan 3. TSMC and ASE serve as co-chairs, and the alliance will collaborate with 3 major domestic and international companies, including Unimicron, Delta, Everlight Chemical, Xinyun, Chroma, Hongsu, Mason, and Junhua, to promote cross-sector collaboration and standardization, creating the world's most comprehensive 3DIC ecosystem.
The AI era drives market explosion, and 3DIC becomes the key driver of post-Moore's Law
According to the latest forecast from market consultancy Yole Intelligence, the advanced packaging market is projected to grow from approximately US$2024 billion in 380 to approximately US$2030 billion in 790, achieving a compound annual growth rate (CAGR) of 12.7%. This growth is primarily driven by the continued advancements in AI and high-bandwidth memory (HBM) processes, which are driving strong demand for high-performance, low-power, and high-density packaging solutions. This has made 3DIC a key technology for system-level integration.
However, 3DIC design still faces challenges such as heterogeneous integration, thermal management, and miniaturized interconnects, necessitating close collaboration across the supply chain. Taiwan, with its comprehensive semiconductor supply chain system, advanced process mass production capabilities, and influence in international cooperation and standard setting, is becoming an indispensable core hub for the development of 3DIC and advanced packaging worldwide.
3DICAMA officially launched, cross-domain collaboration to create a complete ecosystem
3DICAMA is co-chaired by Dr. Jun He, Vice General Manager of Advanced Packaging Technology and Services at TSMC, and Dr. Songjing Hong, Senior Vice General Manager of ASE, who will jointly lead industry chain partners to promote four core tasks.
First, in terms of industrial collaboration, the alliance will connect the semiconductor industry chain, promoting cross-sector technological innovation and experience sharing. Second, it will focus on strengthening supply chain resilience and industrial support, building a more resilient and stable industrial system by enhancing local manufacturing and connecting global resources.
In the development of industry standards, the alliance will integrate SEMI platform resources and industry consensus to establish technical specifications covering materials, processes, and design, promote standard implementation, and assist manufacturers in effectively implementing and implementing systematic application standards. Finally, the alliance will focus on technological and quality upgrades, promoting R&D collaboration in advanced packaging to improve manufacturing efficiency and yield, and actively addressing technical bottlenecks such as thermal management and advanced interconnect architectures.
In the field of measurement and testing, the alliance will strengthen advanced testing technology and quality control, accelerate the implementation of new technologies and the expansion of their applications, promote technology commercialization, and simultaneously promote system software and automation upgrades, communication interface integration, and continuously improve the advanced packaging ecosystem.
SEMI brings together global resources to accelerate technology implementation and ecosystem creation
"The establishment of 3DICAMA fully demonstrates SEMI's leading role as an international platform," said Shih-Lun Tsao, SEMI Global Marketing Director and President of SEMI Taiwan. "We will integrate global resources, promote industry and policy dialogue, accelerate technology implementation and realize business opportunities, and help Taiwan create more efficient and competitive solutions for industries in application areas such as AI, HPC, and data centers."
A photo-taking ceremony was also held at the launch event, showcasing the industry chain's commitment to collaboration. Dr. Zhao-Chong Kuo, Director-General of the Department of Industrial Technology, Ministry of Economic Affairs, also attended and delivered a speech, emphasizing the significance of the alliance's launch in promoting the development of Taiwan's advanced packaging ecosystem and further solidifying the foundation for collaboration between industry, government, academia, and research.
