Tag: Zhiwei Electronics

At the xMEMS Live Asia 2025 event held in Taipei, xMEMS Labs showcased its Sycamore-W micro-driver unit designed for wearable devices, and its µCooling micro-active cooling chip for smart glasses and other wearable devices. The chip boasts a fanless design, aiming to expand its market reach. ▲xMEMS Labs launches µCooling micro-active cooling chip for smart glasses and other wearable devices. xMEMS Labs stated that the Sycamore-W micro-driver unit, designed for wearable devices, uses the same underlying technology as its solid-state cooling chip. It is waterproof, dustproof, and even shockproof. However, unlike the solid-state cooling chip which uses low-frequency cooling for heat dissipation, the Sycamore-W uses high-frequency cooling, emitting bright sound through small holes on the side, and adding richer low-frequency bass. Compared to traditional transflector diaphragm sound generation designs, Sycamore-W is only 1mm thick and weighs only 150mg. It reduces the volume by approximately 70% compared to current sound-generating units used in smartwatches (approximately 20 x 4 x 1.28mm), allowing manufacturers to incorporate larger batteries or more sensors into smartwatches. ▲xMEMS Labs states that Sycamore-W occupies a smaller volume, even smaller than the sound module used by Apple in the Apple Watch (the component at the top of the photo). Regarding the "µCooling" micro-active cooling chip for wearable devices such as smart glasses, its overall size is only approximately 9.3 x 7.6 x 1.13 mm. It can be directly integrated into the frame of smart glasses and effectively reduces the surface temperature of the device by up to 40%, allowing smart glasses to achieve 60-70% or higher performance while preventing users from experiencing discomfort due to high temperatures during extended wear. Unlike traditional fans, "µCooling" uses a solid-state vibration module to drive airflow, operating almost silently and without vibration, making it ideal for wearable devices that are sensitive to sound and have extremely limited internal space. ▲xMEMS Labs has launched the "µCooling" micro-active cooling chip for wearable devices such as smart glasses. They state that this technology can significantly improve the throttling or discomfort caused by overheating in smart glasses, while also enhancing reliability and all-day wearability. ...

Following its solid-state cooling chip developed using MEMS (Micro-Electro-Mechanical Systems) technology, xMEMS Labs has launched "µCooling," a miniature active cooling chip for wearable devices such as smart glasses. Boasting a fanless design that achieves active cooling, it's touted as a "wearable fan." This miniature active cooling chip, "µCooling," measures only about 9.3 x 7.6 x 1.13 mm and can be directly integrated into the frame of smart glasses. It effectively reduces the surface temperature of the device by up to 40%, allowing smart glasses to achieve 60-70% or higher efficiency while preventing discomfort from overheating during extended wear. Unlike traditional fans, "µCooling" uses a solid-state vibration module to drive airflow, operating almost silently and without vibration, making it ideal for wearable devices that are sensitive to sound and have extremely limited internal space. xMEMS Labs states that this technology significantly improves the performance issues or discomfort caused by overheating in smart glasses, while also enhancing reliability and all-day wearability. Mike Housholder, VP of Marketing at xMEMS Labs, emphasized that thermal management is no longer just a performance issue, but also directly impacts the wearing experience and safety of smart glasses. He revealed that "µCooling" is currently the only active cooling solution that can be integrated into the eyeglass frame in a thin and lightweight form, enabling smart glasses to be worn for extended periods of time in daily life. Currently, "µCooling" has begun to provide samples for testing and is expected to enter mass production in early 2026, with the aim of using it in future smart glasses and other wearable devices.

Following its announcement late last year of the Sycamore micro-driver unit, only 1mm thick and touted for use in smart glasses, watches, and other devices, xMEMS Labs has further announced the Sycamore-W micro-driver unit designed for wearable devices. Like last year's Sycamore micro-driver unit, the Sycamore-W is only 1mm thick and weighs only 150mg, reducing its volume by approximately 70% compared to current smartwatch drivers (approximately 20 x 4 x 1.28mm). This allows manufacturers to incorporate larger batteries or more sensors into smartwatches. The Sycamore-W is also waterproof, dustproof, and shockproof, and is built using xMEMS Labs' Microelectromechanical Systems (MEMS) technology. xMEMS Labs plans to begin mass production of the Sycamore-W in the second quarter of 2026, intending to use it in subsequent smartwatches and other wearable devices, while also continuing to update the Sycamore driver unit.

xMEMS Labs announced that it will showcase a mass-produced high-fidelity wireless over-ear headphone with ODM manufacturer Merry Electronics at CES 2025, demonstrating the importance of solid-state microspeakers for future over-ear headphone design. This headphone will utilize xMEMS Labs' Cowell solid-state microspeaker, boasting a 30% improvement in spatial accuracy for game soundstage and music performance, while also being 50% lighter than traditional dynamic speakers. This collaboration between xMEMS Labs and Merry Electronics further creates a modular solution that headphone manufacturers can use in open-back, closed-back, wired, and wireless headphone designs to achieve a superior gaming and music listening experience. The xMEMS Cowell, manufactured using a monolithic silicon process, is used as a microspeaker responsible for mid-high frequencies in a dual-crossover headphone design, providing unparalleled clarity and detail. The semiconductor process enables performance uniformity and +/-1° consistency, as well as phase consistency, of the microspeaker, resulting in perfectly matched left/right mid-high frequencies. Mike Housholder, Vice President of Marketing and Business Development at xMEMS, stated that xMEMS will first launch its xMEMS 2-way crossover headphone concept in July 2024, enabling audio manufacturers to provide their gaming customers with a competitive edge through higher levels of spatial audio precision, while offering a wider soundstage and improved clarity and detail. Merry Electronics President Huang Chaofeng echoed this vision, noting, "For over forty years, we have focused all our product development efforts on electroacoustic products to enhance the listening experience in communications, multimedia, and entertainment. This focus transcends science and engineering, creating products that deliver exceptional sound for our global audio customers. Our collaboration with xMEMS opens an exciting new chapter as we are committed to delivering superior sound that enriches our lives."

xMEMS Labs, a company that uses piezoelectric microelectromechanical technology (MEMS) in headphone drivers and its air-cooled all-silicon active heatsinks, recently announced the new Sycamore micro-driver. This driver can be used in open-back headphones, smart glasses, and smartwatches, delivering full-range audio. The Sycamore micro-driver shares the same design as xMEMS Labs' previous Cypress series drivers with active noise cancellation, using ultrasonic principles to generate full-range audio through a 1mm thick chip. The Sycamore micro-driver produces audio comparable to existing drivers on the market, and even delivers lower frequencies while improving treble performance. It can increase volume by approximately 15dB at 5kHz while preserving clarity and detail. Another design advantage of the Sycamore micro-driver is its size, which is only about one-seventh the size of traditional drivers, one-third the thickness, and up to 70% lighter. This allows for wider application in product designs and its use as a sound-generating element in wearable devices such as smart glasses and watches. Because it uses the same design as previous products, the Sycamore micro-actuator will be able to be produced in a shorter time and applied to related marketed products. Currently, xMEMS Labs expects to provide the first Sycamore micro-actuator samples in the first quarter of 2025, and plans to start mass production in October 2025, with actual application products expected to enter the market in 2026.

xMEMS Labs, which previously used its piezoelectric microelectromechanical technology for headphone drivers and later developed an air-cooled all-silicon active heatsink using the same technology, showcased its designs at a seminar in Taiwan today (September 12). xMEMS Labs CEO Jiang Zhengyao explained that future product development will focus on heatsinks, while continuing to focus on headphone driver applications. ▲xMEMS Labs' XMC-2400 µCooling air-cooled all-silicon active heatsink, built using its piezoelectric microelectromechanical technology. Jiang Zhengyao also stated that they are currently in discussions with numerous semiconductor and packaging companies and anticipate that their products, through high customization and the ability to provide different airflow directions, will have greater application possibilities in small devices such as mobile phones. The XMC-2400 µCooling air-cooled all-silicon active heatsink, proposed in August of this year, measures only 9.26 x 7.6 x 1.08 mm and weighs only 150 milligrams. Compared to traditional active cooling designs, it reduces the volume and weight by up to 96%, and even operates at a driving voltage of only 3V. During the driving process, it can indirectly supplement power through potential difference, thereby achieving energy saving. ▲The XMC-2400 µCooling boasts fully customizable production capabilities and adaptability to different air intake directions, touted as a "breathing radiator." ▲It can generate up to 39 cubic centimeters of air thrust per second under a back pressure of 1000Pa, producing enough bubbles even in a 4-meter-long water pipe, and can even be used as an oxygen exchange device in aquariums. xMEMS Labs also emphasizes its patented, simplified design, allowing for rapid changes in cooling modes and customization to meet customer needs. Furthermore, it can adjust dimensions for different applications, anticipating that its cooling solutions will become a key market demand as smartphones become increasingly thinner and lighter, while processor performance demands continue to rise. Jiang Zhengyao points out that while their product designs can be sized to meet specific needs, their current focus is on small devices. However, xMEMS Labs will continue to observe the application potential of its products in different fields to seek greater growth opportunities. ▲xMEMS Labs CEO Jiang Zhengyao stated that while xMEMS Labs continues to push forward its heatsink solutions, even making them a current development focus, the company emphasizes its continued commitment to headphone solutions. Leveraging its piezoelectric microelectromechanical technology, xMEMS is driving the design of drivers capable of reproducing more nuanced sound details. ▲xMEMS Labs emphasizes its continued commitment to headphone solutions.

xMEMS Labs, the company that previously developed MEMS solid-state speaker technology, has recently created the xMEMS XMC-2400 µCooling, an air-cooled all-silicon active heatsink. It boasts a mere 1mm thickness, delivering silent, vibration-free cooling and utilizing a 1000Pa negative pressure to remove heat generated by the processor. This heatsink will be used in smartphones with increasingly limited space, allowing them to maintain a slim and lightweight design while ensuring stable processor performance without additional noise or vibration. Compared to many high-performance gaming phones that rely on active cooling fans or external heatsinks, xMEMS Labs claims that its xMEMS XMC-2400 µCooling will maintain a slim design while ensuring stable performance. With a thickness of only 1mm and a weight of less than 150mg, xMEMS Labs claims that its air-cooled all-silicon active heatsink, the xMEMS XMC-2400 µCooling, reduces size and weight by up to 96% compared to other cooling products, and removes heat generated by the processor through a 1000Pa negative pressure. Furthermore, the xMEMS XMC-2400 µCooling is IP58 dust and water resistant, meaning it can be used in a wider range of applications, and its manufacturing process is the same as its previously released MEMS speaker unit. xMEMS Labs plans to begin providing xMEMS XMC-2400 µCooling samples for testing in the first quarter of 2025, so gaming phones or small devices emphasizing high-performance operation may incorporate this heatsink design next year. A similar design was previously introduced by Frore Systems, whose AirJet Mini Slim cooling module can generate a wind speed of 200 meters per second. It is also touted as being suitable for mobile phones and IoT devices, but its thickness is 2.5mm, which is obviously slightly thicker than the design proposed by xMEMS Labs.