Samsung's Galaxy Z Flip, launched this year, uses glass provided by South Korean supplier DoInsys.UTG (Ultra Thin Glass)Compared to last year's Galaxy Fold, which only used a soft plastic film to provide better protection, Samsung is likely to resume its collaboration with Corning and is expected to use Corning's soft glass as the outer protective layer of the new phone's screen.
South Korean news website ddaily (디지털데일리) reported thatSamsung plans to work with Corning, expecting the latter to provide soft glass components with better protection, which will be used in the new foldable screen mobile phones that are expected to be launched next.
Judging from the rumors, this foldable phone is expected to be the most popular one in the market.Galaxy Fold 2However, it is also possible that it will be adopted in the foldable screen mobile phone to be launched next year. It mainly depends on Corning’s actual production capacity.
However, neither Samsung nor Corning responded to the rumor, and Corning had already obtained Apple's$2.5 million investment, which is expected to be used for the research and development of innovative glass technology. If it cooperates with Samsung this time, it is expected to receive a large amount of investment from Samsung.
In fact, Corning has long been investing in the research and development of flexible glass that can be bent, and has even introduced several flexible glass products that can cope with large-angle bending. The Willow series of flexible glass launched in the past has now begun to be used in some curved screen protection designs. However, to cope with the usage scenarios of mobile phones with bendable screens, the glass must be able to withstand greater deformation while maintaining its original hardness and light transmission performance.
Corning saidTo allow glass products to bend with greater flexibility is almost like challenging physical limitations. Not only must the glass itself maintain sufficient protective hardness, but it must also be able to withstand repeated bending and even ensure scratch and shatter resistance during use. At the same time, it must also maintain adhesion to the device surface. In fact, the challenges faced are far more than imagined.
