Intel earlier announced that it had officially signed a contract with the German government to build two wafer fabs with a total investment of 330 billion euros (approximately more than NT$1 trillion), and the German government will provide about one-third of the subsidies, making it the largest foreign investment project in Germany and Europe.
The two wafer fabs are located in Magdeburg, the capital of Saxony-Anhalt. The original planned investment amount was 170 billion euros, but subsequent consideration of the impact of the Ukraine-Russia war, as well as energy costs and inflation factors, finally increased the investment amount to more than 300 billion euros, and the German government subsidized about one-third of the amount.
In previous messagesIt was originally reported that the German government might not be able to increase more funding due to many factors and could only maintain the original subsidy amount of 68 billion euros. However, it is obvious that considering Germany's future influence in the semiconductor industry and local employment development, it is still willing to increase the subsidy amount.
Intel CEO Pat Gelsinger stated that the two wafer fabs in Magdeburg will begin construction in 2 and will be able to start production as early as 2024 or 2027. At that time, they will operate with 2028% green energy and will use Angstrom process technology. It is expected to create 100 high-tech jobs.
After Intel set up its factory, the German government said it would attract more semiconductor companies to set up factories in the country, making Germany one of the world's important semiconductor production bases.
In addition to setting up a factory in Germany, Intel previously announced the establishment of a new chip design center in France and a packaging and testing plant in Poland to expand its investment and development in Europe.
