With MWC 2026 about to take place in Barcelona, Spain, news of flagship new products from various major mobile phone manufacturers is flying around. Honor is rumored to be unveiling a new Magic V6 foldable phone at the exhibition, equipped with a Qualcomm Snapdragon 8 Elite Gen 5 processor, which will also break the record for the lightest and thinnest foldable phone.
Honor has confirmed that it will hold a launch event during MWC 2026 at 4:30 pm on March 2nd, Spanish time. It has been confirmed that it will announce the Honor MagicBook Pro 14 laptop, Honor Watch 5 Ultra, Honor Earbuds Open earphones, Honor Tablet V9, and may also unveil the large-size foldable phone codenamed "Phenom" Magic V6.
In terms of core specifications, the Magic V6 will be equipped with a Snapdragon 8 Elite Gen 5 processor. As for its design, Honor seems to intend to maintain its reputation as the "King of Thinness and Lightness".
Previous generation Magic V5With a thickness of only 8.8mm and a weight of 217 grams, the Magic V6 is rumored to be even thinner and will also include a larger battery in an attempt to solve the problem of poor battery life of foldable phones.
In terms of color options, it is expected to offer a variety of choices, including Snow White, Velvet Black, Sunrise Gold, and the eye-catching "Red Rabbit Red".
It is expected to launch in the Hong Kong and Taiwan markets in March.
The report also indicates that after its unveiling at MWC 2026, the Honor Magic V6 is expected to officially launch in the Hong Kong market in March. On the other hand, related reports also suggest that Honor is preparing to enter the Taiwan market, and may release relevant information soon.
