Although the vast majority of this year's first wave of 5G-connected phones still use Qualcomm's Snapdragon X2016 50G data chip, which was launched before 5, Qualcomm earlier announced that starting in 2020, 5G-connected phones released by many manufacturers will be equipped with the Snapdragon X55 5G data chip, along with a new antenna and RF module design. In addition, more 5G terminal connection devices will also adopt this design.
According to the list of partners announced by Qualcomm, they include Arcadyan, Askey, AVM, Casa Systems, Compal, Cradlepoint, Fibocom, FIH, Franklin, Gemtek, Gongjin, Gosuncn Technology Group Co., Ltd., Inseego, LG, Lynksys, MeiG, NETGEAR, Nokia, OPPO, Panasonic Mobile Communications, Co., Ltd., Quanta, Quectel, Sagemcom, Samsung Electronics Co., Ltd., Sharp Corporation, Sercomm, Sierra Wireless, Sunsea, Technicolor, Telit, We-wins, Mobile phone and communications equipment manufacturers including Wingtech Technology (Wingtech), WNC Technology (WNC), and ZTE.
Qualcomm President Cristiano Amon said that the Snapdragon X55 5G modem and related RF system architecture announced this year will support the full range of existing 5G spectrum and connectivity modes, from sub-6GHz to millimeter wave (mmWave). This will enable global telecom operators and OEMs to provide best-in-class 5G connectivity performance for home or enterprise needs, and expand coverage to previously underserved areas.
Compared to the Snapdragon X5 connectivity modem currently used in most 50G mobile phones, Qualcomm's Snapdragon X55 supports download speeds of up to 7Gbps, corresponding to both TDD and FDD operating modes, and is compatible with both NSA and SA connection modes. Simultaneously, by reducing the process to 7nm FinFET, it occupies a relatively smaller space and reduces overall power consumption, thereby extending the phone's connected life.
The Snapdragon X55 data chip also improves 4G LTE connectivity, supporting up to 2.5Gbps download speed, which is almost half the 50G connection speed of the Snapdragon X5 data chip. It corresponds to LTE Cat.22 specifications, 7-phase carrier aggregation, and supports 4×4 MIMO and 256-QAM antenna connections.
In addition, the new, smaller antenna and RF module design allows for greater flexibility in the internal antenna configuration of new 5G-connected mobile phones, and can even further enhance antenna reception, thereby ensuring 5G network connection signal strength.
At the same time, Qualcomm also emphasized that its data chip and antenna solutions will bring enhanced fixed broadband services to urban, suburban and rural environments, and enable 5G network architecture to cover a wide range of connectivity. At the same time, it can also simplify the development process by integrating the system, thereby allowing more 5G network application devices to enter the market faster.
However, in this announcement, Qualcomm did not specifically disclose whether Apple will join its 5G connectivity solution partner. However, from the previous joint statement with Apple, it has actually revealed that the two parties will be entering into a multi-year cooperation relationship in the future, which will include wireless network connection application solutions. Therefore, it is expected that the new iPhone and iPad series models to be launched next year will resume using Qualcomm to provide connectivity data chips.
In addition, Qualcomm has previously revealed that it is expected to launch theIntegrated 5G networking data chip designThe Snapdragon 700 series processors will also use this design, and in the future this design will be extended to the Snapdragon 600 series and Snapdragon 800 series processor products.
