Dafa Technology, a subsidiary of MediaTek, which was established in 2021 by combining Airoha Technology and Chuangfa Technology, announced that its new Bluetooth audio series chips have beenBluetooth Low Energy Audio Standard LE AudioCertification.
Dafa Technology stated that its two major series of chips, "Flagship" and "Professional", both support LE Audio and Bluetooth 5.3 specifications, which will meet the design requirements of true wireless Bluetooth headsets. At the same time, they can also correspond to the design of terminal devices in multiple application scenarios such as Bluetooth smart speakers, hearing aids, and Bluetooth transmitters. A large number of brand customers have currently conducted tests and verifications, and related products are expected to be launched globally in the first half of 2023.
Yang Yuquan, Senior Vice President of Dafa Technology, said: "The LE Audio specification marks the most significant milestone for the Bluetooth audio industry in the past decade. Dafa Technology, with its hundreds-person R&D team amassed nearly a decade of technical expertise, has dedicated itself to this effort. We are one of the first companies in the global industry to achieve certification, and we are also helping many customers shorten the launch of their end products. The wireless audio revolution brought about by the new Bluetooth low energy technology will allow consumers and businesses to quickly enjoy the convenience and innovative services it brings, fully demonstrating the vision and business philosophy that Dafa Technology has always upheld."
The Auracast broadcast audio sharing function is one of the most important technologies certified by the Bluetooth LE Audio specification. It provides one-to-many one-way audio playback capabilities and has become an industry standard. It will significantly change the audio service model of existing dedicated headphones.
The Auracast broadcast audio sharing feature significantly improves user convenience and experience, reduces costs for service providers, and will stimulate new and innovative applications and services. For example, museum tours no longer require the rental of specialized headphones; visitors can simply wear standard portable headphones that meet the standard to actively receive audio services at the venue. Other venues such as large gatherings, sports games, concerts, and even corporate events can also leverage this feature to provide more customized and innovative services, significantly transforming both consumer experiences and business service models.
In addition to supporting broadcast audio, Bluetooth LE Audio also offers the advantages of improved sound quality and low latency. Through the LC3 encoding used in LE Audio, audio can be transmitted at a bit rate less than half that of traditional SBC, without compromising sound quality and significantly reducing latency by 70%.
Dafa Technology has launched two series of chips with the following features:
• Flagship Series:The performance-leading AB1585 supports the latest LE Audio and Bluetooth 5.3. The built-in HiFi 5 DSP provides high computing power, suitable for running AI algorithms and providing customers with customized flexible applications. It is suitable for headphones, TWS, speakers, and hearing aids, etc., and can provide an unimaginable personalized wireless audio experience.
• Professional Series:The AB1565/AB1568, featuring low power consumption and high integration, supports the latest LE Audio and Bluetooth 5.3. Suitable for headphones, TWS, speakers, and Bluetooth transmitters, they can quickly facilitate mass adoption in enterprise and professional market applications while providing a superior user experience.
