At Embedded World 2026 in Nuremberg, Germany, MediaTek officially unveiled its new generation of the MediaTek Genio computing platform, including the Genio Pro targeting the high-end market, and the Genio 420 and Genio 360 targeting mainstream commercial applications. The flagship Genio Pro not only uses TSMC's 3nm process, but also incorporates an "all-big-core" architecture and an 8th-generation NPU, on par with top-tier mobile chips. This signifies MediaTek's precise application of its mobile communications technology to the rapidly growing markets of industrial robots, commercial drones, and edge AI devices.
Genio Pro: A 3nm process "all-big-core" architecture redefines high-end IoT computing power.
As the highlight of this announcement, the Genio Pro is undoubtedly a performance monster prepared by MediaTek for high-end embedded systems. It not only adopts TSMC's latest 3nm process but also brings the "all-big-core" CPU architecture originally used in the Dimensity flagship mobile chip to the IoT platform. The Genio Pro integrates the Arm v9.2 architecture, including one Cortex-X925 super core, three Cortex-X4 cores, and four Cortex-A720 cores, providing a powerful computing performance of up to 260K DMIPS; paired with the Arm Immortalis-G925 GPU, its graphics performance reaches 3.1 TFLOPS.
In terms of the most crucial AI computing power, the Genio Pro is equipped with MediaTek's 8th generation NPU, achieving a system-level generative AI computing power exceeding 50 TOPS. It can smoothly run large-scale language models (LLMs) with up to 70 billion parameters directly on the device, with a generation rate of up to 23 tokens/s.
Furthermore, Genio Pro offers an exceptionally wide range of visual capabilities, particularly in terms of spatial awareness, which is crucial for commercial drones and high-end service robots.
• Multi-lens sensing fusion:支援多達16顆鏡頭同時輸入，可透過虛擬通道技術處理多達16路FHD30影像，或是同時處理2路4K30與8路FHD30攝影輸入。
• A rich developer ecosystem:It widely supports various Linux distributions such as Yocto, Debian, and Ubuntu, and natively supports the open-source ROS (Robot Operating System) architecture, greatly reducing friction in robot development.
• Industrial-grade durability:It features a wide temperature range (-40°C to +105°C) and can handle extreme factory or outdoor environments.
Genio 420 and 360: Targeting the mainstream market and strengthening BOM cost advantages
In addition to the high-end Genio Pro, MediaTek has also targeted the huge mainstream and entry-level markets.
• Genio 420:Utilizing a 6nm process, it delivers 7.2 TOPS of system-level AI computing power. Its biggest highlight is the direct integration of 16GB LPDDR5X memory, which helps OEMs significantly simplify motherboard design and reduce BOM (Bill of Materials) costs. Even better, it is pin-to-pin compatible with the previous Genio 720/520, allowing customers to seamlessly upgrade their existing product lines.
• Genio 360 vs. 360P:Targeting smart homes and mainstream commercial IoT, it provides 6 TOPS and 8.5 TOPS of computing power respectively, which is enough to run a large language model with 20 billion parameters on the device, enabling ordinary cash registers or smart home appliances to have basic generative AI voice understanding capabilities.
Regarding the launch timeline, the Genio 360 series has already begun sampling; the Genio 420 is expected to be sampled in April 2026; while the flagship Genio Pro is expected to be sampled in the first quarter of 2026 and enter mass production in the third quarter.
