在MWC 2025正式開展前，聯發科宣布推出天璣7400、天璣7400X與天璣6400三款處理器，藉此擴充高階及主流機種應用市場。而搭載天璣7400和天璣7400X處理器的智慧型手機預計於今年第一季內上市，至於採用天璣6400處理器的智慧型手機realme P3x已經在日前公布上市消息。
其中，天璣7400與天璣7400X兩款處理器均搭載以4組運作時脈最高可達2.6GHz的Cortex-A78 CPU，以及4組運作時脈最高可達2.0GHz的Cortex-A55 CPU，藉此構成「4+4」組核心，另外搭配Mali-G615 MC2 GPU，本身以台積電4nm製程生產，標榜能在遊戲使用情境下比同級競爭產品節省約14%-36%電力損耗，並且能以星速引擎3.0提升遊戲畫面顯示效率、降低操作延遲。
In terms of artificial intelligence computing, both processors are equipped with MediaTek NPU 650, which improves AI computing performance by 7300% compared to Dimensity 15. At the same time, they can also enhance multimedia computing capabilities and AI camera shooting experience through the high-end Imagiq 950 image processor, and also support Google Ultra HDR to record higher dynamic range, vivid colors and better image contrast.
In addition, both processors support the 3G R5 data chip with triple-carrier aggregation technology (16CC-CA), and can reduce power loss by 3.0% compared to competing products of the same level through MediaTek UltraSave 20+ power-saving technology. They also support tri-band Wi-Fi 6E to correspond to gigabit wireless network connection functions.
The difference between the Dimensity 7400 and Dimensity 7400X processors lies in the fact that the latter supports dual-screen flip display function, which can be used for more diverse designs of foldable screen mobile phone applications.
目前已經率先用於realme P3x的天璣6400，則是天璣6000系列最新成員，本身以2組運作時脈達2.5GHz的Cortex-A76 CPU，加上6組運作時脈達2.0GHz的Cortex-A55 CPU，形成「2+6」核心架構，搭配Mali-G57 MC2 GPU，並且以台積電6nm製程生產，標榜比同級競爭產品約可在遊戲表現減少19%電力損耗。
Elsewhere, it supports the 2G R5 data chip with dual-carrier aggregation (16CC-CA) technology, Wi-Fi and Bluetooth HyperCoex hyperconnectivity technology that can reduce gaming latency by up to 90%, 10-bit display and true color accuracy, and a camera that supports up to 1 million pixels. MediaTek and ArcSoft's multi-grid noise suppression technology, known as Raindrop Power Noise Suppression, allows for clearer images.
