Following the recent announcement of the M12 90G-Advanced data chip, which uses artificial intelligence to achieve peak download speeds of 5Gbps, MediaTek announced that it will showcase several technologies at MWC 2025 that are expected to become key foundations of future 6G mobile communication networks. These technologies include cloud-edge-device converged computing, as well as low-orbit NR-NTN technology and sub-band full-duplex technology for real-world connectivity.
MediaTek stated that it is preparing for the upcoming 6G network technology standard proposal, which includes proposing cloud, edge, and terminal converged computing technology, combining the device cloud and radio access network (RAN) into an "edge cloud" to extend ambient computing from the device end to the radio access network, thereby making mobile computing more seamlessly integrated.
MediaTek also exhibited its Envelope-Assisted RF Front-End System, which it claims can improve the energy efficiency of power amplifiers by 25%, reduce device power consumption and heat generation, and increase the available bandwidth by over 100MHz within the same power envelope, while also extending the coverage of high-power signals.
Sub-Band Full Duplex (SBFD) technology, proposed for upcoming 6G mobile communication networks, will improve upload efficiency and reduce latency in unpaired TDD (Time Division Duplex) spectrum, thereby overcoming the problem of close-range signal interference between the transmitting and receiving antennas of small devices.
In addition to showcasing the new M90 5G-Advanced data chip application project, MediaTek will also showcase an intelligent CPE (Intelligent Customer Premises Equipment) incorporating self-generative AI technology at MWC 2025. The device will also feature a 3Tx antenna designed with MediaTek technology, significantly increasing uplink rates by 1.9 times and being compatible with various 5G NR frequency band combinations. Through low-latency, low-loss, scalable throughput (L4S) technology, it can significantly reduce network latency by 95% while also minimizing packet loss.
MediaTek will also showcase its Non-Terrestrial Network (NTN) satellite communication design for 5G-Advanced connectivity technology, showcasing the results of a NR-NTN field trial using the Ku-band spectrum of OneWeb's low-orbit satellites. This trial utilized Eutelsat OneWeb's LEO satellites manufactured by Airbus, MediaTek's NR-NTN test chip, the Industrial Technology Research Institute's (ITRI) NR-NTN test base station (gNB), and Sharp's Ku-band array antennas, all supported by Rohde & Schwarz test equipment.
Other parts include the display of MediaTek's Dimensity Auto smart cockpit chipset platform, Dimensity 9400 processor and other products. In addition, MediaTek will also showcase customized chip solutions using SerDes technology. It will cooperate with major wafer fabs to develop the most advanced process, chip-to-chip connection, high-speed I/O, memory packaging and ultra-large package design technical capabilities.
