During MWC 2015, Intel confirmed that it would introduce a new naming method for the Atom series processors. Similar to the Core i series, the processors are clearly differentiated by performance and are classified into Atom X3, X5 and X7. The X3 series directly integrates 3G or LTE communication modules and is a SoFIA series processor in cooperation with Rockchip. It will mainly target lower-priced smartphone application products, while the X5 and X7 series will target tablet devices, 2 in 1 devices or small laptop products, and are highly compatible with the Windows 10 operating system.
As for the current long-term weak position in the mobile phone market, Intel CEO Brian Krzanich emphasized that with the introduction of new processors, Intel will be able to catch up with its competitors faster and is confident that it can significantly improve its current development disadvantages.
Intel officially announced the new naming method for the Atom series processors at the MWC 2015 event. The processors will be differentiated based on performance similar to the Core i series processors, and will be classified as Atom X3, X5 and X7. The X3 series directly integrates 3G or LTE communication modules, and is a SoFIA series processor jointly developed with Rockchip. It will mainly target lower-priced smartphones or tablets with sizes ranging from 4 inches to 8 inches, and will promote reference design devices to enable partners to promote corresponding products more quickly.
Currently, commercial products using the Atom X3 processor are expected to be released later this quarter, while the LTE version is expected to be released before the end of this year. The X5 and X7 series will adopt the 14nm process design similar to the Core i series processors and provide more than twice the 3D display performance, mainly for mainstream tablet devices, 2 in 1 devices or small laptops. Actual commercial products are expected to be released in the first half of this year at the earliest, and are highly compatible with the Windows 10 operating system expected to be released in the third quarter of this year.
As for the layout of LTE market applications, Intel is also preparing to provide the XMM 7360 data communication chip in application products before the end of the second half of this year. It mainly integrates global communication frequencies and complies with LTE Cat.6 specifications, providing a maximum download rate of 450Mbps and supporting 3-way carrier aggregation technology, which can be applied to smartphones to PC products.
At the event, Intel CEO Brian Krzanich also emphasized that Intel has always focused on products above tablet devices, but its development of smartphone product applications lags far behind other competitors. This situation will improve. He believes that Intel will accelerate its pace to catch up with its competitors with the momentum of its future development, and is confident that it will significantly improve its current development disadvantages.
