Intel Foundry earlier announced that Defense Industrial Base (DIB) customers Trusted Semiconductor Solutions and Reliable MicroSystems have become Phase III members of its Rapid Assured Microelectronics Prototypes-Commercial (RAMP-C) program, expanding the scope of the program and launching its Intel 18A test chip phase.
“We are delighted to welcome Trusted Semiconductor Solutions and Reliable MicroSystems to Intel Foundry’s RAMP-C program with the U.S. Department of Defense,” said Kapil Wadhera, vice president and general manager of the Aerospace, Defense & Government Group at Intel Foundry. “This collaboration will advance leading-edge, secure semiconductor solutions, which are critical to national security, economic growth, and technological leadership. We are proud of the key role Intel Foundry plays in supporting U.S. defense and look forward to working closely with our newest DIB customers to enable their innovations using leading-edge Intel 18A technology.”
“The RAMP-C program continues to advance advanced microelectronics technologies for Department of Defense and commercial applications, supporting U.S. leadership in semiconductor design and manufacturing to enhance national security,” said Dr. Catherine Cotell, T&AM Program Manager in the Office of the Under Secretary of Defense for Research and Engineering.
In the RAMP-C program, Intel Foundry assists strategic customers, intellectual property (IP), electronic design automation (EDA), and design service providers to shorten Intel Foundry technology design time.
Providing DIB customers with early access to advanced semiconductor technology is crucial for meeting the defense industry's critical size, weight, and power requirements. The Intel 18A is Intel's most significant transistor innovation since the introduction of FinFETs into mass production in 2011. It integrates Intel's new PowerVia backside power technology and RibbonFET Gate-All-Around (GAA) technology, significantly improving performance per watt and density.
In addition, DIB customers can also take advantage of Intel Foundry advanced packaging technologies such as Embedded Multi-die Interconnect Bridge (EMIB), which provides high interconnect density for heterogeneous chips to meet the current complex chip computing needs.
