Recently announced the launch of itsThird-generation silicon photonics co-packaging technology, and after cooperating with Corning, Delta Electronics, Hon Teng Precision, Micas Networks and Twinstar Technologies to introduce technology, Manish Mehta, vice president of marketing and operations of Broadcom Optical Systems, explained today (5/18) how Broadcom is using silicon photonics co-packaging technology to promote the current development trend of artificial intelligence, and emphasized expanding the application ecosystem of silicon photonics co-packaging technology with more industry supply chains.
The third-generation silicon photonics co-packaging technology can achieve up to 200G data transmission in a single channel, which is twice the data transmission rate compared to the second-generation design. This will significantly reduce power loss and signal interference compared to traditional copper electronics, while also increasing data transmission rates.
Manish Mehta emphasized that Broadcom has been investing in silicon photonics co-packaging technology for quite a long time. He also explained that although the foundation of this technology originated from the 1998G VCSEL laser technology acquired from HP in 1, it has continued to improve this technical specification in the future and has recently advanced to 100G and 200G transmission specifications. It also plans to develop the fourth-generation silicon photonics co-packaging technology in the future, with the goal of achieving a single channel that can correspond to 400G data transmission.
Therefore, Manish Mehta explained that Broadcom has invested a considerable amount of time in the application of silicon photonics co-packaging technology. He also emphasized the establishment of a huge ecosystem with many partners in the market so that silicon photonics co-packaging technology can be applied in a wider range of artificial intelligence application fields.
TSMC is also investingCompact Universal Photon Engine (COUPE)At the same time, many companies are also planning to develop the application of silicon photonics co-packaging technology. Broadcom's position is more inclined to continue investing in related technologies and jointly promote market growth with market partners.
As the demand for artificial intelligence computing continues to grow, the market has begun to expand the scale of artificial intelligence computing through network connections. NVIDIA also acquired Mellanox Technologies in 2019 and subsequently integrated it into the NVIDIA network as part of its artificial intelligence technology development. Manish Mehta also stated that Broadcom will work with market partners to promote the market ecosystem, and revealed that NVIDIA is actually one of the partners, so he does not think the two will become competitors.
However, the choice to emphasize the joint promotion of AI application development with Taiwan's supply chain and partners before the official start of Computex 2025 further highlights Broadcom's desire to assert its important role as a driving force behind the growth of AI applications.
