Broadcom announced that the industry's first custom computing system-on-a-chip (SoC) based on the 3.5D XDSiP platform and manufactured using a 2nm process has begun shipping. This chip, which combines Face-to-Face (F2F) and 2.5D/3D-IC integration technologies, will significantly increase the computing density of large AI clusters. It has already been adopted by Fujitsu in Japan, becoming a key component in driving its next-generation high-performance processor plan.
What is 3.5D XDSiP and Face-to-Face integration technology?
In the past few years, 2.5D packaging technology, represented by TSMC's CoWoS, has supported half of the AI chip market (such as NVIDIA's high-end GPUs). However, as transistor miniaturization approaches physical limits, Broadcom has further launched a mature modular multidimensional stacking platform called 3.5D eXtreme Dimension System in Package (XDSiP).
The core of this technology lies in the use of Face-to-Face (F2F) technology to deeply integrate 2.5D and 3D ICs. Through this three-dimensional chip stacking method, customers can create advanced XPUs (referring to various accelerator chips) with "ultra-high signal density", "excellent power efficiency", and "ultra-low latency".
More importantly, the XDSiP platform breaks the dead end of traditional chip design, allowing computing cores, memory, and network I/O interfaces to be "independently expanded" in a compact design specification, ensuring that AI infrastructure can maintain high performance and low power consumption when scaled up.
First customer: Promoting Fujitsu's "FUJITSU-MONAKA" self-developed chip project
Broadcom not only announced its technology this time, but also directly announced actual shipments to its first customers.
Frank Ostojic, Senior Vice President and General Manager of Broadcom's ASIC Product Division, stated that the team has successfully delivered Fujitsu's first 3.5D custom chip. Fujitsu's Senior Vice President, Naoki Shinjo, also praised the achievement highly, believing that this combination of 2nm process technology and F2F technology unlocks unprecedented computing density and energy efficiency.
This first shipment of customized chips will drive Fujitsu's next-generation...FUJITSU-MONAKA ProjectThe core engine aims to create an industry-leading high-performance, low-power processor to address the challenges of a future, larger, and more sustainable AI-driven society.
Targeting gigawatt-level AI clusters, shipments will be expanded in the second half of 2026.
This is just the first step in Broadcom's 3.5D strategy. Since the initial launch of its 3.5D XDSiP platform technology in 2024, Broadcom has continued to expand the platform's performance and compatibility. The company has announced that it will support a wider range of customers in developing custom XPUs using this platform, with larger-scale mass production and shipments expected to begin in the second half of 2026.
