AMD earlierConfirm將於美國東岸時間8月29日晚間7點 (台灣時間為8月30日上午7點)舉辦線上直播發表活動，預期將正式公佈日前已經公佈的Ryzen 7000 series desktop processors, and the corresponding 600 series chipsets.
Prior to this, AMD has collaborated with five motherboard manufacturers, including ASUS, MSI, ASRock, GIGABYTE, and BIOSTAR, to announce details of motherboards that use the X670E and X670 chipsets and are compatible with the Ryzen 7000 series desktop processors. More details about the new products and the expected launch schedule are expected to be announced in the future.
Earlier reports indicated that AMD planned to launch sales of its Ryzen 9 series desktop processors in mid-September, along with motherboards equipped with the 7000 series chipset. However, the release date may be postponed to September 600, the date of Intel Innovation, when the 9th generation Core series desktop processors, codenamed Raptor Lake, are expected to be announced. This may indicate a stronger competitive atmosphere.
Prior to this, AMD has stated that the Ryzen 7000 series desktop processors are designed with the Zen 4 architecture and integrate two sets of computing cores through the chiplet design. The processor itself is built with TSMC's 5nm process, while the I/O control DIE design is built with TSMC's 6nm process. The maximum operating clock can reach over 5GHz. Each core will be equipped with 1MB of L2 cache memory, thereby increasing the computing performance of a single execution thread by 15%, and adding artificial intelligence computing assistance.
Other parts include the integration of RDNA 2 display architecture, and corresponding DDR5 memory and PCIe 5.0 connection ports.
As for the pin design, it corresponds to the AM5 slot specifications, with a total of 1718 pins. It has also been changed from the original PGA to LGA design, which can natively correspond to the 170W power supply design and is compatible with the radiator accessories that previously corresponded to the AM4 slot, so existing radiators can be directly used on AM5 slot motherboards.
連接能力方面，AM5插槽主機板最多可支援24組PCIe 5.0連接埠，以及總計14組對應20Gbps傳輸速率且相容USB-C設計的USB連接埠，本身也支援Wi-Fi 6E無線網路規格，以及最高4組HDMI 2.1或DisplayPort 2.0連接埠組合。
Motherboards equipped with the X670E chipset support higher overclocking space and can use two PCIe 5.0 graphics cards and a single NVMe SSD. Motherboards equipped with the X670 chipset only have one PCIe 5.0 NVMe SSD expansion slot. Other parts include support for M.2 25100 specification SSDs, USB 4.0, and Thunderbolt 3 or Thunderbolt 4 ports.
